Members of the International Steering Committee of the EMLC
and
Members of the International Technical Program Committee of the EMLC 2008 (*)

Program Chairs        Dr. W. Maurer (*), InfineonTechnologies AG, Munich, Germany
                                      Mr. J. Waelpoel (*), ASML, Veldhoven, The Netherlands

Mr. F. Abboud	Intel Corp., Santa Clara, CA, USA
Dr. M. Arnz	Carl Zeiss SMT AG, Oberkochen, Germany (*)
Mr. E. Baracchi	ST Microelectronics, Agrate Brianza, Italy
Dr. C. Blaesing	Carl Zeiss SMS GMbH, Jena, Germany
Mr. P Chen	Taiwan Mask Corp., Hsinchu, Taiwan (*)
Dr. C. Constantine	Oerlikon USA Inc., St. Petersburg, FL, USA (*)
Prof. R. Engelstad	University of Wisconsin, Madison, WI, USA
Mr. B.G. Eynon	Sematech-Samsung Assignee, Albany, USA (*)
Mr. D. Farrar	HOYA Corporation, LONDON, UK
Mr. M. Fischer	KLA Tencor GmbH, Puchheim, Germany
Mr. O. Fortagne	Vistec Semiconductor Systems GmbH, Jena, Germany
Mr. C. Gale	Applied Materials, Dresden, Germany(*)
Mr. B. Grenon	Grenon Consulting, Inc., Colchester, VT, USA (*)
Mr. H. Hartmann	s3solution, Munich, Germany
Mr. N. Hayashi	Dai Nippon Printing Co. Ltd., Saitama, Japan (*)
Dr. A.C. Hourd	Compugraphics International Ltd., Glenrothes, Scotland, UK (*)
Mr. R. Jonckheere	IMEC, Leuven, Belgium (*)
Dr. C.K. Kalus	Synopsys GmbH, Aschheim, Germany (*)
Mr. K.R. Kimmel	AMTC, Dresden, Germany (*)
Ms. B. Lauche	Photronics MZD GMbH, Dresden, Germany
Mr. H. Lehon	KLA-Tencor Corporation, San Jose, CA, USA
Dr. H. Loeschner	IMS Nanofabrication AG, Vienna, Austria (*)
Mr. B. Naber	Cadence Design Systems Inc., San Jose, USA (*)
Mr. J. Perrocheau	JEMI-France, Rousset, France
Dr. Ch. Pierrat	Cadence Design Systems Inc., San Jose, USA (*)
Mr. E. Rausa	Oerlikon USA Inc., Saint Petersburg, FL, USA (*)
Dr. C. Reita	CEA-LETI, Grenoble, France
Mr. D. J. Resnick	Molecular Imprints, Austin, TX, USA (*)
Dr. F. Reuther	micro resist technology GmbH, Berlin, Germany
Dr. C. Romeo	ST-Microelectronics, Agrate Brianza, Italy (*)
Mr. K. Ronse	IMEC, Leuven, Belgium
Prof. H. Scheer	University of Wuppertal, Germany (*)
Mr. Gerd Scheuring	Mue Tec GmbH, Munich, Germany
Dr. R. Schnabel	VDE/VDI-GMM, Frankfurt, Germany (*)
Mr. M. Staples	AMD Saxony LLC & Co. KG, Dresden, Germany
Mrs. I. Stolberg	Vistec Semiconductor Systems GmbH, Jena, Germany (*)
Dr. S. Tedesco	CEA-LETI, Grenoble, France (*)
Mr. M. Tissier	Toppan Photomasks S.A., Rousset, France (*)
Mr. G. Unger	Qimonda Dresden GmbH & Co. OHG, Dresden, Germany (*)
Mr. J.T. Weed	SYNOPSYS, Inc., Mountain View, CA, USA
Mr. J. Whittey	Vistec Semiconductor Systems, Oakdale, USA (*)
Mr. J. Wiley	Brion Technologies, Santa Clara, CA, USA
Mr. H. Wolf	Photronics MZD GmbH, Dresden, Germany (*)
Mr. N. Yoshioka	Renesas Technology Corp., Tokyo, Japan
Mr. L. Zurbrick	KLA-Tencor Corporation, San Jose, CA, USA (*)